EBCA46S2H-32.768K TR

EBCA46S2H-32.768K TR REGULATORY COMPLIANCE (Data Sheet downloaded on Jan 9, 2020) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Automotive Grade Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.62Vdc to 3.63Vdc 4 Pad 2.0mm x 2.5mm Ceramic Surface Mount (SMD) 32.768KHz ±100ppm over -40°C to +125°C ELECTRICAL SPECIFICATIONS Nominal Frequency 32.768KHz Frequency Tolerance/Stability ±100ppm Maximum over -40°C to +125°C (Inclusive of all conditions: Calibration Tolerance (at 25°C), Frequency Stability over the Operating Temperature Range, Supply Voltage Change (±5%), Output Load Change (±5%), and First Year Aging at 25°C) Aging at 25°C ±3ppm/year Maximum Supply Voltage 1.62Vdc to 3.63Vdc Input Current 50µA Typical, 100µA Maximum (Unloaded, Vdd = 3.3Vdc) Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -1mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +1mA) Rise/Fall Time 15nSec Maximum (Measured at 10% to 90% of Waveform) Duty Cycle 50 ±5(%) (Measured at 50% of Waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Output Control Input Voltage Logic High (Vih) 70% of Vdd Minimum or No Connect to Enable Output Output Control Input Voltage Logic Low (Vil) 30% of Vdd Maximum to Disable Output (High Impedance) Standby Current 1µA Typical, 3µA Maximum (Disable Output: High Impedance) Start Up Time 2mSec Maximum Storage Temperature Range -55°C to +125°C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 1 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EBCA46S2H-32.768K TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 2.00 ±0.10 0.675 ±0.100 (x4) 2 MARKING ORIENTATION 2.50 ±0.10 1.00 MAX 3 0.95 ±0.10 PIN CONNECTION 1 Tri-State 2 Case/Ground 3 Output 4 Supply Voltage LINE MARKING 1 4 0.775 ±0.100 (x4) 1 32.768K 2 XXX XXX=Ecliptek Manufacturing Identifier 0.65 ±0.10 Seam Sealed Terminal Plating Thickness: Gold (0.3 to 1.0µm) over Nickel (1.27 to 8.89µm). Suggested Solder Pad Layout All Dimensions in Millimeters 1.00 (X4) 1.20 (X4) Solder Land (X4) 0.50 0.30 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 2 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EBCA46S2H-32.768K TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 3 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EBCA46S2H-32.768K TR Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01µF (Note 1) 0.1µF (Note 1) Ground CL (Note 3) Tri-State Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 4 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EBCA46S2H-32.768K TR Tape & Reel Dimensions Quantity Per Reel: 3,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 ±0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 ±0.05 1.75 ±0.10 3.50 ±0.05 MARKING ORIENTATION 8.00 ±0.30 DIA 1.00 MIN 4.00 ±0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 14.40 MAX DIA 40 MIN Access Hole at Slot Location 180 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 ±0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 8.40 +1.50/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 5 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EBCA46S2H-32.768K TR Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 6 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EBCA46S2H-32.768K TR Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/Second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 240°C Maximum 240°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/14/2019 | Page 7 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200